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* High Isolation: 40 dB Low Current draw: < 2mA @ +5 V < 10mA @ -5V 5V CMOS Logic 45mm PBGA Package JEDEC MO-151 Foot Print PBGA Package Outl.

in the AMPS frequency bands. The SW-461 is constructed with a multi layer PCB using a ball grid array for the I/O connec.

M/A-COM’s SW-461 is a multi-chip module containing six SP4T GaAs switches, each with a driver/decoder and four GaAs 6-way power dividers. The SW-461 utilizes Plastic Ball Grid Array (PBGA) interconnect technology to achieve high circuit density and s.

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